Fabrication of nano-scale Cu bond pads with seal design in 3D integration applications

Kuan-Neng Chen*, C. K. Tsang, Wen-Wei Wu, S. H. Lee, J. Q. Lu

*Corresponding author for this work

研究成果: Article同行評審

4 引文 斯高帕斯(Scopus)

摘要

A method to fabricate nano-scale Cu bond pads for improving bonding quality in 3D integration applications is reported. The effect of Cu bonding quality on inter-level via structural reliability for 3D integration applications is investigated. We developed a Cu nano-scale-height bond pad structure and fabrication process for improved bonding quality by recessing oxides using a combination of SiO2 CMP process and dilute HF wet etching. In addition, in order to achieve improved waferlevel bonding, we introduced a seal design concept that prevents corrosion and provides extra mechanical support. Demonstrations of these concepts and processes provide the feasibility of reliable nano-scale 3D integration applications.

原文English
頁(從 - 到)3336-3339
頁數4
期刊Journal of Nanoscience and Nanotechnology
11
發行號4
DOIs
出版狀態Published - 1 十二月 2011

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