Experimental investigations on airside performance of heat sinks having pin fin configurations

Kai Shing Yang*, Wei Hsin Chu, Ing Yong Chen, Chi-Chuan Wang

*Corresponding author for this work

研究成果: Conference contribution同行評審

摘要

This study performs an experimental study of pin fin heat sinks having circular, elliptic, and square cross-section. A total of twelve pin fin heat sinks having inline and staggered arrangements were made and tested. The effect of fin density on the heat transfer performance is examined. For inline arrangement, circular pin fin shows an appreciable influence of fin density whereas no effect of fin density is seen for square fin geometry. This is associated with the unique deflection flow pattern accompanied with the inline circular fin configuration. For the staggered arrangement, the heat transfer coefficient increases with the rise of fin density for all the three configurations. The elliptic pin fin shows the lowest pressure drops. For the same surface area at a fixed pumping power, the circular pin fin possesses the smallest thermal resistance for the inline arrangement. In the meantime, the circular pin fin slightly outperforms those other pin fin configuration under a staggered arrangement.

原文English
主出版物標題Twenty-Third Annual IEEE Semiconductor Thermal Measurement and Management Symposium, SEMI-THERM Proceedings 2007
頁面208-212
頁數5
DOIs
出版狀態Published - 27 八月 2007
事件23rd Annual IEEE Semiconductor Thermal Measurement and Management Symposium, SEMI-THERM - San Jose, CA, United States
持續時間: 18 三月 200722 三月 2007

出版系列

名字Annual IEEE Semiconductor Thermal Measurement and Management Symposium
ISSN(列印)1065-2221

Conference

Conference23rd Annual IEEE Semiconductor Thermal Measurement and Management Symposium, SEMI-THERM
國家United States
城市San Jose, CA
期間18/03/0722/03/07

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