Experimental investigation of high performance thermal module with dimple vortex generators

Kai Shing Yang*, Kuo Liang Wun, Ing Youn Chen, Chi-Chuan Wang

*Corresponding author for this work

研究成果: Conference contribution同行評審

2 引文 斯高帕斯(Scopus)

摘要

Pressure drop and heat transfer characteristics of different dimple vortex generators arrangement are examined in this study. A total of five heat sinks were made and tested, including plain fin, dimple, two-group dimple, oblique dimple gap 4-12 fin, oblique dimple gap 6-12 fin. The tested results indicate that the pressure drop for dimple fin geometry is significantly higher than other fin types, followed by the two group dimple fin. The fin structure with oblique dimple shows slightly increase of pressure drop as compared to the plain fin surface. The results show that more complicated fin structure will lead to higher pressure drop. The observed IR image of the temperature measurement of the test fin configurations also proves the measurements. The results suggest that the fin with dimple vortex generators is more beneficial than that of plain fin geometry. The oblique dimple fin is especially useful for air-cooling applicable for electronic devices to achieve effective augmentations without suffering from significant pressure penalty.

原文English
主出版物標題International Microsystems Packaging Assembly and Circuits Technology Conference, IMPACT 2010 and International 3D IC Conference, Proceedings
DOIs
出版狀態Published - 1 十二月 2010
事件2010 5th International Microsystems, Packaging, Assembly and Circuits Technology Conference, IMPACT 2010 and International 3D IC Conference - Taipei, Taiwan
持續時間: 20 十月 201022 十月 2010

出版系列

名字International Microsystems Packaging Assembly and Circuits Technology Conference, IMPACT 2010 and International 3D IC Conference, Proceedings

Conference

Conference2010 5th International Microsystems, Packaging, Assembly and Circuits Technology Conference, IMPACT 2010 and International 3D IC Conference
國家Taiwan
城市Taipei
期間20/10/1022/10/10

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