Direct cooling with inert and hazards free dielectric liquids may well become the method of choice for thermal management of future electronic systems. Owing to the efficiency of phase-change process and the ease of natural circulation, pool boiling is of great interest for this application. The present review consolidates a large number of pool boiling experimental data for dielectric and other highly wetting liquids subject to engineered surfaces with elaborating the related augmentation mechanisms. Potential micro/nano engineered surfaces are categorized into one-dimensional (either CHF or HTC enhancing) and two-dimensional (both CHF and HTC) enhancement surfaces. The enhancement mechanisms along with the bubble dynamics of these enhanced surfaces are discussed briefly. Furthermore, a general classification of electronics coolants (dielectric, non-dielectric, and nanofluids) along with their thermophysical properties is made; especially the problems associated with the dielectric liquids are discussed. Finally, the potential mechanisms for higher HTCs and CHFs are identified.
|期刊||International Communications in Heat and Mass Transfer|
|出版狀態||Published - 十二月 2020|