Enhanced pool boiling of dielectric and highly wetting liquids - a review on enhancement mechanisms

Uzair Sajjad, Ali Sadeghianjahromi, Hafiz Muhammad Ali*, Chi Chuan Wang

*Corresponding author for this work

研究成果: Article同行評審

8 引文 斯高帕斯(Scopus)

摘要

Direct cooling with inert and hazards free dielectric liquids may well become the method of choice for thermal management of future electronic systems. Owing to the efficiency of phase-change process and the ease of natural circulation, pool boiling is of great interest for this application. The present review consolidates a large number of pool boiling experimental data for dielectric and other highly wetting liquids subject to engineered surfaces with elaborating the related augmentation mechanisms. Potential micro/nano engineered surfaces are categorized into one-dimensional (either CHF or HTC enhancing) and two-dimensional (both CHF and HTC) enhancement surfaces. The enhancement mechanisms along with the bubble dynamics of these enhanced surfaces are discussed briefly. Furthermore, a general classification of electronics coolants (dielectric, non-dielectric, and nanofluids) along with their thermophysical properties is made; especially the problems associated with the dielectric liquids are discussed. Finally, the potential mechanisms for higher HTCs and CHFs are identified.

原文English
文章編號104950
期刊International Communications in Heat and Mass Transfer
119
DOIs
出版狀態Published - 十二月 2020

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