Electromigration in flip chip solder joints having a thick Cu column bump and a shallow solder interconnect

Jae Woong Nah*, J. O. Suh, King-Ning Tu, Seung Wook Yoon, Vempati Srinivasa Rao, Vaidyanathan Kripesh, Fay Hua

*Corresponding author for this work

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Physics & Astronomy