EHD enhanced heat transfer with needle-arrayed electrodes

H. Y. Li*, R. T. Huang, W. J. Sheu, Chi-Chuan Wang

*Corresponding author for this work

研究成果: Conference contribution同行評審

5 引文 斯高帕斯(Scopus)

摘要

Natural convection heat transfer enhanced by electrohydrodynamics (EHD) is experimentally investigated in this work. Four kinds of electrode arrangements on a plate fin heat sink are made and tested under a controlled environment. Previous and present test results show that the rate of heat transfer with EHD is greater than that under natural convection due to the corona wind generated by the electron avalanche mechanism. To identify the effect of EHD, the enhancement ratio, defined as the heat transfer coefficient with EHD (h EHD) relative to that without EHD (hNC), is proposed to examine the performance. Generally, the enhancement ratio increases with the supply voltage regardless of the electrode arrangement or with the electrode polarity. This ratio reaches a maximum of around 4.4 within the operating voltage of 0 - 18 kV. For a fixed voltage, the negative polarity has a better performance compared with the positive one no matter the electrode arrangement and the electrode distance. In addition, the threshold voltage for the negative polarity is also lower than that for the positive one. Both phenomena can be attributed to the greater emission current emitted from the electrode surface for the negative polarity. For a fixed electrode distance, there is an optimal electrode density under which the area impinged by the corona wind is insufficient, and beyond which the flow interference by adjacent electrodes is encountered.

原文English
主出版物標題Twenty-Third Annual IEEE Semiconductor Thermal Measurement and Management Symposium, SEMI-THERM Proceedings 2007
頁面149-154
頁數6
DOIs
出版狀態Published - 27 八月 2007
事件23rd Annual IEEE Semiconductor Thermal Measurement and Management Symposium, SEMI-THERM - San Jose, CA, United States
持續時間: 18 三月 200722 三月 2007

出版系列

名字Annual IEEE Semiconductor Thermal Measurement and Management Symposium
ISSN(列印)1065-2221

Conference

Conference23rd Annual IEEE Semiconductor Thermal Measurement and Management Symposium, SEMI-THERM
國家United States
城市San Jose, CA
期間18/03/0722/03/07

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