Effective strategy for porous organosilicate to suppress oxygen ashing damage

Po-Tsun Liu*, T. C. Chang, Y. S. Mor, C. W. Chen, T. M. Tsai, C. J. Chu, Fu-Ming Pan, S. M. Szea

*Corresponding author for this work

研究成果: Article同行評審

23 引文 斯高帕斯(Scopus)

摘要

Photoresist stripping with oxygen plasma ashing destroys numerous functional groups in porous organosilicate glasses (OSGs). This impact makes the porous OSG relatively hydrophilic and causes low-k dielectric degradation. To mitigate these issues, various strategies are investigated to enhance oxygen plasma resistance of the porous OSG. These include physical and chemical procedures. Both structural and electrical analyses are used to determine their efficiency. In addition, an optimum prescription that consists of H2 plasma and chemical trimethylchlorosilane treatment is developed in this work. The enhancement of oxygen plasma resistance can provide the porous OSG for practical application in the multilevel interconnection.

原文English
期刊Electrochemical and Solid-State Letters
5
發行號3
DOIs
出版狀態Published - 1 三月 2002

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