Effect of thermal treatment on physical, electrical properties and reliability of porogen-containing and porogen-free ultralow-k dielectrics

Yu Min Chang, Wei Yuan Chang, Jun Fu Huang, Leu-Jih Perng, Yi Lung Cheng*

*Corresponding author for this work

研究成果: Article同行評審

13 引文 斯高帕斯(Scopus)

指紋 深入研究「Effect of thermal treatment on physical, electrical properties and reliability of porogen-containing and porogen-free ultralow-k dielectrics」主題。共同形成了獨特的指紋。

Chemical Compounds

Engineering & Materials Science

Physics & Astronomy