Effect of Sn Grain Orientation on Formation of Cu6Sn5 Intermetallic Compound Under Current Stressing

Ming Yao Chen, Han wen Lin, Chih Chen*

*Corresponding author for this work

研究成果: Article同行評審

2 引文 斯高帕斯(Scopus)

指紋 深入研究「Effect of Sn Grain Orientation on Formation of Cu<sub>6</sub>Sn<sub>5</sub> Intermetallic Compound Under Current Stressing」主題。共同形成了獨特的指紋。

Chemical Compounds

Engineering & Materials Science

Physics & Astronomy