Effect of passivation on stress relaxation in electroplated copper films

Dongwen Gan, Paul S. Ho, Yaoyu Pang, Rui Huang*, Leu-Jih Perng, Jose Maiz, Tracey Scherban

*Corresponding author for this work

研究成果: Article同行評審

40 引文 斯高帕斯(Scopus)

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Physics & Astronomy

Chemical Compounds

Engineering & Materials Science