Effect of entropy production on microstructure change in eutectic SnPb flip chip solder joints by thermomigration

Fan Yi Ouyang*, King-Ning Tu, Yi Shao Lai, Andriy M. Gusak

*Corresponding author for this work

研究成果: Article同行評審

58 引文 斯高帕斯(Scopus)

摘要

Thermomigration in flip chip solder joints of eutectic SnPb has been studied at an ambient temperature of 100 °C. Redistribution of Sn and Pb occurs with Pb moving to the cold end. A stepwise concentration profile is observed. Significantly, the lamellar microstructure becomes much finer after thermomigration. Since the lamellar interface is disordered and is a fast path of diffusion, it indicates a high rate of entropy production in the thermomigration, in agreement with Onsager's principle of irreversible processes. The effect of entropy production on microstructure change is shown here. The molar heat of transport of Pb has been calculated to be -25.3 kJmole.

原文English
文章編號221906
期刊Applied Physics Letters
89
發行號22
DOIs
出版狀態Published - 7 十二月 2006

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