Due-date assignment for wafer fabrication under demand variate environment

W.l. Pearn*, S. H. Chung, C. M. Lai

*Corresponding author for this work

研究成果: Article同行評審

30 引文 斯高帕斯(Scopus)

摘要

In the semiconductor industry, dynamic changes in demand force companies to change the product mix frequently and periodically. Assigning tight but attainable due dates is a great challenge under the circumstances that the product mix changes periodically. In this paper, we consider the due-date assignment problem for wafer fabrication and present a due-date assignment model to set manufacturing due dates satisfying the target on-time-delivery rate. The contamination model is applied to tackle the effect of that product mix varies periodically. We demonstrate the effectiveness and accuracy of the proposed model by solving a real-world example taken from a wafer fabrication shop floor in an IC manufacturing factory.

原文English
頁(從 - 到)165-175
頁數11
期刊IEEE Transactions on Semiconductor Manufacturing
20
發行號2
DOIs
出版狀態Published - 1 五月 2007

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