Direct measurement of hot-spot temperature in flip-chip solder joints with Cu columns under current stressing using infrared microscopy

Yu Chun Liang*, Chih Chen, D. J. Yao

*Corresponding author for this work

研究成果: Conference contribution同行評審

摘要

In this study, the temperature map distribution in the Sn3.0Ag0.5Cu solder bump with Cu column under current stressing is directly examined using infrared microscopy. It is the radiance changes between the different materials of the surface that cause the unreasonable temperature map distribution. By coating a thin layer of black optical paint which is in order to eliminate the radiance changes, we got the corrected temperature map distribution. Under a current stress of 1.15 × 104 A/cm2 at 100 °C, the hot-spot temperature is 132.2°C which surpasses the average Cu column temperature of 129.7°C and the average solder bump temperature of 127.4 °C. Thermomigration in solder may still occur under a large current stressing.

原文English
主出版物標題Advanced Interconnects and Chemical Mechanical Planarization for Micro- and Nanoelectronics
頁面259-264
頁數6
DOIs
出版狀態Published - 24 十二月 2010
事件2010 MRS Spring Meeting - San Francisco, CA, United States
持續時間: 5 四月 20109 四月 2010

出版系列

名字Materials Research Society Symposium Proceedings
1249
ISSN(列印)0272-9172

Conference

Conference2010 MRS Spring Meeting
國家United States
城市San Francisco, CA
期間5/04/109/04/10

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