Development of silicon based heat spreader for high power electronic devices

Qingjun Cai*, Bing Chung Chen, Chailun Tsai, Yuan Zhao, Chung-Lung Chen

*Corresponding author for this work

研究成果: Conference contribution同行評審

1 引文 斯高帕斯(Scopus)

摘要

This article presents the development of silicon based heat spreader devices, called hexcells. Several key technical aspects, including the hexcell MEMS fabrication process, mechanical strength studies, vacuum sealing technique, and phase change and mass transport visualization, have been developed and studied. The hexcell development prototypes are fabricated by MEMS photolithography and dry-etch processes, with eutectic bonding to form a sealed silicon chamber with openings for charging with the working fluid. Using Ansys as the modeling tool, we optimized the hexcell total mechanical strength by incorporating six interior support posts to reinforce the structure. In terms of the optimized design, experimental results on actual hexcell samples show that a well-bonded hexcell can withstand over 60psi without destructive failure. Vacuum sealing are divided into helium and vapor leakage tests. With metalized and solder-sealed sidewalls, both testing results confirm good vacuum sealing. The wick structure used in the present hexcell is silicon pillars with dimensions of 50μm in diameter and 250μm in height. The pillars are etched before the hexcell is bonded and formed. Experiments using the silicon wick structure demonstrate over 300W/cm2 cooling capacity and visualization shows the intensive phase change on the heating area.

原文English
主出版物標題Proceedings of the ASME Micro/Nanoscale Heat and Mass Transfer International Conference 2009, MNHMT2009
頁面443-448
頁數6
DOIs
出版狀態Published - 12 七月 2010
事件ASME 2009 Micro/Nanoscale Heat and Mass Transfer International Conference 2009, MNHMT2009 - Shanghai, China
持續時間: 18 十二月 200921 十二月 2009

出版系列

名字Proceedings of the ASME Micro/Nanoscale Heat and Mass Transfer International Conference 2009, MNHMT2009
3

Conference

ConferenceASME 2009 Micro/Nanoscale Heat and Mass Transfer International Conference 2009, MNHMT2009
國家China
城市Shanghai
期間18/12/0921/12/09

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