Design of AC-coupled circuit for high-speed interconnects

Chun Wei Huang*, Kai Jen Liu, Yu Jung Huang, Ming Kun Chen, Yi Lung Lin, Ming-Dou Ker

*Corresponding author for this work

研究成果: Conference contribution同行評審

2 引文 斯高帕斯(Scopus)

摘要

The scaling of semiconductor technology together with 3D IC stacking integration make it possible for many portable electronics to process large amount of multimedia data. AC-coupling enables chip placed face-to-face for signal transmission using close-field capacitive coupling. A high performance system design using AC coupled interconnect (ACCI) technology not only achieves shorter and faster interconnection between dies but also increases packaging density. This paper describes a chip-to-chip circuit design suitable for high-speed 3DIC interconnected applications. The AC-Coupled face-to-face (F2F) chip was simulated using HSPICE with TSMC 0.18-μm 1P6M CMOS technology process file under a 1.8 V supply voltage. The simulation results indicated the proposed circuit with the self-test characteristics can achieve differential signal transmission up to 2.5 Gbps.

原文English
主出版物標題2012 IEEE Global High Tech Congress on Electronics, GHTCE 2012
頁面87-90
頁數4
DOIs
出版狀態Published - 1 十二月 2012
事件2012 IEEE Global High Tech Congress on Electronics, GHTCE 2012 - Shenzhen, China
持續時間: 18 十一月 201220 十一月 2012

出版系列

名字2012 IEEE Global High Tech Congress on Electronics, GHTCE 2012

Conference

Conference2012 IEEE Global High Tech Congress on Electronics, GHTCE 2012
國家China
城市Shenzhen
期間18/11/1220/11/12

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