This work presents a MEMS-based (micro-electro-mechanical system) thermal actuating image stabilizer. The proposed stage is designed as a 4-axis decoupling XY stage and 1.49 × 1.49 × 0.4 mm3 in size. This stabilizer is fabricated by Silicon on Isolator (SOI) process, including inductively coupled plasma (ICP) process and flip-chip bonding technique. The maximum actuating distance of the stage is 25 μm which is sufficient to resolve the anti-shaking problem in 3X optical zoom condition of a three mega pixels image sensor. According to the simulation of CoventorWare, the supplied voltage for the 25 μm moving distance is lower than 20 volts.