Design, fabrication and actuation of 4-axis thermal actuating image stabilizer

Chun Ying Lin*, Tsung Ying Tsai, Jin-Chern Chiou, Chin Ping Chien

*Corresponding author for this work

研究成果: Conference contribution

摘要

This work presents a MEMS-based (micro-electro-mechanical system) thermal actuating image stabilizer. The proposed stage is designed as a 4-axis decoupling XY stage and 1.49 × 1.49 × 0.4 mm3 in size. This stabilizer is fabricated by Silicon on Isolator (SOI) process, including inductively coupled plasma (ICP) process and flip-chip bonding technique. The maximum actuating distance of the stage is 25 μm which is sufficient to resolve the anti-shaking problem in 3X optical zoom condition of a three mega pixels image sensor. According to the simulation of CoventorWare, the supplied voltage for the 25 μm moving distance is lower than 20 volts.

原文English
主出版物標題NEMS 2011 - 6th IEEE International Conference on Nano/Micro Engineered and Molecular Systems
頁面192-196
頁數5
DOIs
出版狀態Published - 4 十月 2011
事件6th IEEE International Conference on Nano/Micro Engineered and Molecular Systems, NEMS 2011 - Kaohsiung, Taiwan
持續時間: 20 二月 201123 二月 2011

出版系列

名字NEMS 2011 - 6th IEEE International Conference on Nano/Micro Engineered and Molecular Systems

Conference

Conference6th IEEE International Conference on Nano/Micro Engineered and Molecular Systems, NEMS 2011
國家Taiwan
城市Kaohsiung
期間20/02/1123/02/11

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  • 引用此

    Lin, C. Y., Tsai, T. Y., Chiou, J-C., & Chien, C. P. (2011). Design, fabrication and actuation of 4-axis thermal actuating image stabilizer. 於 NEMS 2011 - 6th IEEE International Conference on Nano/Micro Engineered and Molecular Systems (頁 192-196). [6017327] (NEMS 2011 - 6th IEEE International Conference on Nano/Micro Engineered and Molecular Systems). https://doi.org/10.1109/NEMS.2011.6017327