Curing kinetics and viscosity change of a two-part epoxy resin during mold filling in resin-transfer molding process

Chang Lun Lee, Kung-Hwa Wei

研究成果: Article同行評審

43 引文 斯高帕斯(Scopus)

摘要

The curing kinetics and the resulting viscosity change of a two-part epoxy/amine resin during the mold-filling process of resin-transfer molding (RTM) of composites was investigated. The curing kinetics of the epoxy/amine resin was analyzed in both the dynamic and the isothermal modes with differential scanning calorimetry (DSC). The dynamic viscosity of the resin at the same temperature as in the mold-filling process was measured. The curing kinetics of the resin was described by a modified Kamal kinetic model, accounting for the autocatalytic and the diffusion-control effect. An empirical model correlated the resin viscosity with temperature and the degree of cure was obtained. Predictions of the rate of reaction and the resulting viscosity change by the modified Kamal model and by the empirical model agreed well with the experimental data, respectively, over the temperature range 50-80°C and up to the degree of cure α = 0.4, which are suitable for the mold-filling stage in the RTM process.

原文English
頁(從 - 到)2139-2148
頁數10
期刊Journal of Applied Polymer Science
77
發行號10
DOIs
出版狀態Published - 1 九月 2000

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