Copper-to-copper direct bonding on highly (111) oriented nano-twinned copper in no-vacuum ambient

Jing Ye Juang*, Chia Ling Lu, Kuan Ju Chen, Tao Chih Chang, Chih Chen

*Corresponding author for this work

研究成果: Conference contribution同行評審

1 引文 斯高帕斯(Scopus)

摘要

In this study, we achieve the Cu-to-Cu direct bonding by using the (111) oriented nano-twined-Cu in N2 ambient, without vacuum condition and no additional thermal annealing treatment is needed. A well bonded interface under a temperature gradient between 400 °C and 100 °C was identified by the evidence of the grown grain across the bonding interface. In addition, a creep assisted bonding mechanism for the Cu-Cu direct bonding is proposed. Moreover, a shear test was applied on the bonded joints for the investigation of the bonded joint strength and its fracture mode. The mean value of joint strength is 176 MPa which is significantly higher than the conventional solder joint. In summary, the Cu-to-Cu direct bonding by (111) oriented nt-Cu in no-vacuum ambient as well as the grain evolution across the bonding interface has been achieved and verified.

原文English
主出版物標題IMPACT 2017 - 12th International Microsystems, Packaging, Assembly and Circuits Technology Conference, Proceedings
發行者IEEE Computer Society
頁面199-201
頁數3
ISBN(電子)9781538647196
DOIs
出版狀態Published - 12 一月 2018
事件12th International Microsystems, Packaging, Assembly and Circuits Technology Conference, IMPACT 2017 - Taipei, Taiwan
持續時間: 25 十月 201727 十月 2017

出版系列

名字Proceedings of Technical Papers - International Microsystems, Packaging, Assembly, and Circuits Technology Conference, IMPACT
2017-October
ISSN(列印)2150-5934
ISSN(電子)2150-5942

Conference

Conference12th International Microsystems, Packaging, Assembly and Circuits Technology Conference, IMPACT 2017
國家Taiwan
城市Taipei
期間25/10/1727/10/17

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