Built-in self-test/repair methodology for multiband RF-Interconnected TSV 3D integration

Shu Feng Cheng, Po Tsang Huang, Li Chun Wang*, Mau Chung Frank Chang

*Corresponding author for this work

研究成果: Article同行評審

摘要

Editor's note: Multiband radio-frequency interconnect (MRFI) is an emerging technology to achieve low-latency and energy-efficient on-chip communication. This article proposes a BIST method to improve the reliability of MRFI-based design. -Partha Pratim Pande, Washington State University.

原文English
文章編號8786260
頁(從 - 到)63-71
頁數9
期刊IEEE Design and Test
36
發行號6
DOIs
出版狀態Published - 十二月 2019

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