Analytical and experimental verification of interleaved trapezoidal heat sink

Hong Long Chen, Chi-Chuan Wang

研究成果: Conference contribution同行評審

1 引文 斯高帕斯(Scopus)

摘要

The objective of this paper is to explore the technique for lowering the contraction and hydraulic developing region pressure drop, in order to gain more airflow for electronic cooling heat sink for the same footprint and fin number. By combining two different geometrical perimeter shapes of fins, odd number is rectangular shape, and even number is trapezoidal shape, this new fin module design gains extra 10% airflow with little loss or equivalent thermal performance. Current data center server is suffering from too little airflow to cool essential chips due to enormous flow impedance for packing too many components inside. This technology is the solution to resolve this bottleneck. The precious extra 10% more airflow not only cools CPU chip itself; but also quite beneficial to cool other heating components inside servers. Also, this new design excels in low velocity of 2 m/s for thermal performance compared to original design. Lower velocity is equal to lower RPM of fan that leads to the advantage of energy saving.

原文English
主出版物標題33rd Annual Semiconductor Thermal Measurement and Management Symposium, SEMI-THERM 2017 - Proceedings
發行者Institute of Electrical and Electronics Engineers Inc.
頁面197-203
頁數7
ISBN(電子)9781538615317
DOIs
出版狀態Published - 11 四月 2017
事件33rd Annual Semiconductor Thermal Measurement and Management Symposium, SEMI-THERM 2017 - San Jose, United States
持續時間: 13 三月 201717 三月 2017

出版系列

名字Annual IEEE Semiconductor Thermal Measurement and Management Symposium
ISSN(列印)1065-2221

Conference

Conference33rd Annual Semiconductor Thermal Measurement and Management Symposium, SEMI-THERM 2017
國家United States
城市San Jose
期間13/03/1717/03/17

指紋 深入研究「Analytical and experimental verification of interleaved trapezoidal heat sink」主題。共同形成了獨特的指紋。

引用此