An RDL-First Fan-out Wafer Level Package for Heterogeneous Integration Applications

Yu Min Lin, Sheng Tsai Wu, Wen Wei Shen, Shin Yi Huang, Tzu Ying Kuo, Ang Ying Lin, Tao Chih Chang, Hsiang Hung Chang, Shu Man Lee, Chia Hsin Lee, Jay Su, Xiao Liu, Qi Wu, Kuan-Neng Chen

研究成果: Conference contribution同行評審

7 引文 斯高帕斯(Scopus)

摘要

Fan-out wafer-level packaging (FOWLP), a new heterogeneous integration technology, is gradually becoming an attractive solution. Compared with conventional 2.5D/3D IC structures, fan-out WLP does not use a costly interposer element and can have a thin, high-density, and low-cost IC paAdd additional source...ckaging. In this study, a novel fan-out WLP with RDL-first method is demonstrated. Finite element method was used to optimize the warpage control of a reconstituted wafer and to identify the material properties and fabrication for the FOWLP. Calculation results were applied in the design of the test vehicle. Reliability testing of each component level was performed with different techniques such as temperature cycling test (TCT), high temperature storage (HTS) and thermal humidity storage test (THST). The demonstration of RDL-first WLP technology without interposer proves that it has excellent potential for heterogeneous integration applications.

原文English
主出版物標題Proceedings - IEEE 68th Electronic Components and Technology Conference, ECTC 2018
發行者Institute of Electrical and Electronics Engineers Inc.
頁面349-354
頁數6
ISBN(列印)9781538649985
DOIs
出版狀態Published - 7 八月 2018
事件68th IEEE Electronic Components and Technology Conference, ECTC 2018 - San Diego, United States
持續時間: 29 五月 20181 六月 2018

出版系列

名字Proceedings - Electronic Components and Technology Conference
2018-May
ISSN(列印)0569-5503

Conference

Conference68th IEEE Electronic Components and Technology Conference, ECTC 2018
國家United States
城市San Diego
期間29/05/181/06/18

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