An investigation of thermal spreading device with thermal via in high power LEDs

Kai Shing Yang*, Yu Lieh Wu, Ing Young Chen, Chi-Chuan Wang

*Corresponding author for this work

研究成果: Conference contribution同行評審

1 引文 斯高帕斯(Scopus)

摘要

A detailed numerical simulation of the performance of thermal module having "thermal via" is made in this study. The results indicate the temperature distributions from the numerical simulation are significantly affected by spreading resistance. The filled thermal via can considerably improve the performance of thermal module. For further explanation of the significant drop of junction and thermal resistance at sub-mount with thermal via, the detailed thermal resistances distribution in the thermal module are further examined. It is found that the significant drop of thermal resistance is mainly from package level with the help of thermal via filled in submount. However, the effect of PCB on the thermal resistance is quite different for the simulated geometries, a "maximum" ratio of thermal resistance of PCB had occurred. The thermal resistance of heat sink remains the same for all simulated case. With further adding the thermal via, the effect of heat sink on the overall resistance will become more and more pronounced.

原文English
主出版物標題IMPACT Conference 2009 International 3D IC Conference - Proceedings
頁面195-198
頁數4
DOIs
出版狀態Published - 1 十二月 2009
事件IMPACT Conference 2009 International 3D IC Conference - Taipei, Taiwan
持續時間: 21 十月 200923 十月 2009

出版系列

名字IMPACT Conference 2009 International 3D IC Conference - Proceedings

Conference

ConferenceIMPACT Conference 2009 International 3D IC Conference
國家Taiwan
城市Taipei
期間21/10/0923/10/09

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