An implantable 128-channel wireless neural-sensing microsystem using TSV-embedded dissolvable μ-needle array and flexible interposer

Po-Tsang Huang, Yu Chieh Huang, Shang Lin Wu, Yu Chen Hu, Ming Wei Lu, Ting Wei Sheng, Fung Kai Chang, Chun Pin Lin, Nien Shang Chang, Hung Lieh Chen, Chi Shi Chen, Jeng-Ren Duann, Tzai-Wen Chiu, Wei Hwang, Kuan-Neng Chen, Ching-Te Chuang, Jin-Chern Chiou

研究成果: Conference contribution同行評審

摘要

For implanted neural-sensing devices, one of the remaining challenges is to transmit stable power/data (P/D) transmission for high spatiotemporal resolution neural data. This paper presents a miniaturized implantable 128-channel wireless neural-sensing microsystem using TSV-embedded dissolvable μ-needle array, a flexible interposer and 4 dies by 2.5D/3D TSV heterogeneous SiP technology. The 4 dies are 2 neural-signal acquisition ICs implemented by 90nm CMOS, 1 neural-signal processor by 40nm CMOS and 1 wireless P/D transmission circuitry by 0.18μm CMOS. Thus, the proposed wireless microsystem realizes 128-channel neural-signal sensing within the area of 5mm × 5mm, neural feature extraction and wireless P/D transmission using an on-interposer inductor. The overall average power of the circuits in this microsystem is only 9.85mW.

原文English
主出版物標題IEEE International Symposium on Circuits and Systems
主出版物子標題From Dreams to Innovation, ISCAS 2017 - Conference Proceedings
發行者Institute of Electrical and Electronics Engineers Inc.
ISBN(電子)9781467368520
DOIs
出版狀態Published - 25 九月 2017
事件50th IEEE International Symposium on Circuits and Systems, ISCAS 2017 - Baltimore, United States
持續時間: 28 五月 201731 五月 2017

出版系列

名字Proceedings - IEEE International Symposium on Circuits and Systems
ISSN(列印)0271-4310

Conference

Conference50th IEEE International Symposium on Circuits and Systems, ISCAS 2017
國家United States
城市Baltimore
期間28/05/1731/05/17

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