An image combiner and acquisition interface for space remote sensing applications

Tsan Jieh Chen*, Her-Ming Chiueh, Hann Huei Tsai, Chin Fong Chiu

*Corresponding author for this work

研究成果: Conference contribution同行評審

4 引文 斯高帕斯(Scopus)

摘要

high resolution image combination and processing plays an important role in today's satellites' remote sensing applications. This paper presents an image recombination and processing circuitries (ICAI) for one-dimensional multi-strip CMOS image sensors. The proposed system take advantage of the satellites' linear moving property to control the expose time of CMOS image sensor and provides the realtime ability to continuous generate 12, 000 × N high-resolution image for space remote sensing applications. The ICAI chip contains an image sensor control logics, image combiner, and host interface, one-dimensional pixel is combined to form a two-dimensional image by proposed circuitry. A prototype chip of ICAI was designed and fabricated with TSMC 0.18 μm CMOS 1P6M technology. The die size is 2.91 mm by 2.91 mm, and the power consumption is 20 mW operating at 8MHz under a 1.8 V supply voltage.

原文English
主出版物標題2009 52nd IEEE International Midwest Symposium on Circuits and Systems, MWSCAS '09
頁面475-478
頁數4
DOIs
出版狀態Published - 1 十二月 2009
事件2009 52nd IEEE International Midwest Symposium on Circuits and Systems, MWSCAS '09 - Cancun, Mexico
持續時間: 2 八月 20095 八月 2009

出版系列

名字Midwest Symposium on Circuits and Systems
ISSN(列印)1548-3746

Conference

Conference2009 52nd IEEE International Midwest Symposium on Circuits and Systems, MWSCAS '09
國家Mexico
城市Cancun
期間2/08/095/08/09

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