Accurate in-situ measurement of peak noise and signal delay induced by interconnect coupling

T. Sato*, D. Sylvester, Y. Cao, Chen-Ming Hu

*Corresponding author for this work

研究成果: Conference article同行評審

8 引文 斯高帕斯(Scopus)

摘要

Interconnect models were proposed to translate the analog behavior of interconnect coupling noise into digital output and reveal the actual waveform without uncertainties arising from parasitics in direct probing. A4-metal layer test chip was fabricated to demonstrate the use of in-situ measurement technique to evaluate subnanosecond on-chip coupling effects. Time domain technique was used to measure the signal delay for a wide range comparator (WRC) circuit implemented to capture transient waveforms. The analysis suggested increase in the driver size and reduction in the peak delay change as well as the noise pulse width.

原文English
頁(從 - 到)226-227
頁數2
期刊Digest of Technical Papers - IEEE International Solid-State Circuits Conference
DOIs
出版狀態Published - 1 十二月 2000
事件2000 IEEE International Solid-State Circuits Conference 47th Annual ISSCC - San Francisco, CA, United States
持續時間: 7 二月 20009 二月 2000

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