A study of encapsulation resin containing hexagonal boron nitride (hBN) as inorganic filler

Tzu Hsuan Chiang, Tsung-Eong Hsien*

*Corresponding author for this work

研究成果: Article同行評審

37 引文 斯高帕斯(Scopus)

摘要

Preparation and property characterization of encapsulation resin contained hexagonal boron nitride (hBN) as inorganic filler were carried out in this work. The dielectric properties, coefficient of thermal expansion (CTE), thermal conductivity, curing kinetics, adhesion strength and viscosity of the resins with the load of hBN filler ranging from 9.2 to 25.7 vol.% (20-70 wt.%) were evaluated. It was found that the dielectric properties of resin containing SiO2 filler are inferior to that containing hBN. Also, the resins possessed lower CTE and the higher T g when the hBN contents were high (>15 vol.%) and the resin containing 25.7 vol.% hBN exhibited the largest thermal conductivity of 1.08 W/m K. Adhesion strength of the composite resins decreased with increase of hBN content and the adhesion strength on various substrates was found to be in the order of: alumina > Si wafer > eutectic PbSn solder.

原文English
頁(從 - 到)175-183
頁數9
期刊Journal of Inorganic and Organometallic Polymers and Materials
16
發行號2
DOIs
出版狀態Published - 1 一月 2006

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