A scalable micro wireless interconnect structure for CMPs

Suk Bok Lee*, Sai Wang Tam, Ioannis Pefkianakis, Songwu Lu, Mau-Chung Chang, Chuanxiong Guo, Glenn Reinman, Chunyi Peng, Mishali Naik, Lixia Zhang, Jason Cong

*Corresponding author for this work

研究成果: Conference contribution同行評審

155 引文 斯高帕斯(Scopus)

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Engineering & Materials Science