A scalable micro wireless interconnect structure for CMPs

Suk Bok Lee*, Sai Wang Tam, Ioannis Pefkianakis, Songwu Lu, Mau-Chung Chang, Chuanxiong Guo, Glenn Reinman, Chunyi Peng, Mishali Naik, Lixia Zhang, Jason Cong

*Corresponding author for this work

研究成果: Conference contribution同行評審

155 引文 斯高帕斯(Scopus)

摘要

This paper describes an unconventional way to apply wireless networking in emerging technologies. It makes the case for using a two-tier hybrid wireless/wired architecture to interconnect hundreds to thousands of cores in chip multiprocessors (CMPs), where current interconnect technologies face severe scaling limitations in excessive latency, long wiring, and complex layout. We propose a recursive wireless interconnect structure called the WCube that features a single transmit antenna and multiple receive antennas at each micro wireless router and offers scalable performance in terms of latency and connectivity. We show the feasibility to build miniature on-chip antennas, and simple transmitters and receivers that operate at 100-500 GHz sub-terahertz frequency bands. We also devise new two-tier wormhole based routing algorithms that are deadlock free and ensure a minimum-latency route on a 1000-core on-chip interconnect network. Our simulations show that our protocol suite can reduce the observed latency by 20% to 45%, and consumes power that is comparable to or less than current 2-D wired mesh designs.

原文English
主出版物標題MobiCom'09 - Proceedings of the Annual International Conference on Mobile Computing and Networking
頁面217-228
頁數12
DOIs
出版狀態Published - 30 十一月 2009
事件15th Annual ACM International Conference on Mobile Computing and Networking, MobiCom 2009 - Beijing, China
持續時間: 20 九月 200925 九月 2009

出版系列

名字Proceedings of the Annual International Conference on Mobile Computing and Networking, MOBICOM

Conference

Conference15th Annual ACM International Conference on Mobile Computing and Networking, MobiCom 2009
國家China
城市Beijing
期間20/09/0925/09/09

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