A micropower biomedical signal processor for mobile healthcare applications

Shu Yu Hsu*, Yao Lin Chen, Po Yao Chang, Jui Yuan Yu, Ten-Fang Yang, Ray Jade Chen, Chen-Yi Lee

*Corresponding author for this work

研究成果: Conference contribution

16 引文 斯高帕斯(Scopus)

摘要

This work presents a biomedical signal processor (BSP) with hybrid functional cores to optimize the power dissipation and system flexibility for mobile healthcare applications. Embedded with the biomedical core and a 32-bit RISC core, multi-features are extracted for classification and the abnormal data are compressed. In addition, the crypto core secures both the data and wireless link protocols to protect the user privacy. This BSP chip is fabricated in a 90nm standard CMOS technology with core area of 1.17mm 2. To overcome the leakage in advanced technology, a duty-cycled clock generator minimizes the system active duty and the inactive functions are power gated. Operating at 25MHz frequency and 0.5V supply voltage, the energy of RISC core is down to 3.44pJ/cycle. Accompanied with dedicated biomedical and crypto cores, the average BSP power achieves 38μW at 25MHz and 0.5/1.0V when performing the ECG alarm application.

原文English
主出版物標題2011 Proceedings of Technical Papers
主出版物子標題IEEE Asian Solid-State Circuits Conference 2011, A-SSCC 2011
頁面301-304
頁數4
DOIs
出版狀態Published - 1 十二月 2011
事件7th IEEE Asian Solid-State Circuits Conference, A-SSCC 2011 - Jeju, Korea, Republic of
持續時間: 14 十一月 201116 十一月 2011

出版系列

名字2011 Proceedings of Technical Papers: IEEE Asian Solid-State Circuits Conference 2011, A-SSCC 2011

Conference

Conference7th IEEE Asian Solid-State Circuits Conference, A-SSCC 2011
國家Korea, Republic of
城市Jeju
期間14/11/1116/11/11

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  • 引用此

    Hsu, S. Y., Chen, Y. L., Chang, P. Y., Yu, J. Y., Yang, T-F., Chen, R. J., & Lee, C-Y. (2011). A micropower biomedical signal processor for mobile healthcare applications. 於 2011 Proceedings of Technical Papers: IEEE Asian Solid-State Circuits Conference 2011, A-SSCC 2011 (頁 301-304). [6123572] (2011 Proceedings of Technical Papers: IEEE Asian Solid-State Circuits Conference 2011, A-SSCC 2011). https://doi.org/10.1109/ASSCC.2011.6123572