A low-power mandarin-specific hearing aid chip

Cheng Wen Wei*, Yu Ting Kuo, Kuo Chiang Chang, Cheng Chun Tsai, Jihi Yu Lin, Yi FanJiang, Ming Hsien Tu, Chih-Wei Liu, Tian-Sheuan Chang, Shyh-Jye Jou

*Corresponding author for this work

研究成果: Conference contribution同行評審

11 引文 斯高帕斯(Scopus)

摘要

This paper presents a digital hearing aid chip designed for Mandarin user to enhance speech quality and intelligibility. The hearing aid consists of an 18 subbands analysis and synthesis filter bank, insertion gain stage, and three channels wide dynamic range control for the new Mandarin-specific auditory compensation algorithm. A noise reduction block based on multiband spectral subtraction and enhanced entropy voice activity detection is also included to enhance quality. We reduce the power consumption of these algorithms through algorithmic and architecture optimization. In addition, for the data storage requirement, a low power SRAM that can operate at 0.6V and below is developed. Moreover, several strategies such as multi-clock domain, bypass mode, and voltage scaling are also adopted for power reduction. The chip measurement shows that the hearing aid consumes 314uW at 0.6V.

原文English
主出版物標題2010 IEEE Asian Solid-State Circuits Conference, A-SSCC 2010
頁面333-336
頁數4
DOIs
出版狀態Published - 1 十二月 2010
事件2010 6th IEEE Asian Solid-State Circuits Conference, A-SSCC 2010 - Beijing, China
持續時間: 8 十一月 201010 十一月 2010

出版系列

名字2010 IEEE Asian Solid-State Circuits Conference, A-SSCC 2010

Conference

Conference2010 6th IEEE Asian Solid-State Circuits Conference, A-SSCC 2010
國家China
城市Beijing
期間8/11/1010/11/10

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