A low noise and robust 3D system-in-package test scheme for highly integrated biomedical systems

Chia Yi Lin*, Wai-Chi Fang, Hung-Ming Chen, Zong Han Hsieh, Chiu Kuo Chen

*Corresponding author for this work

研究成果: Conference contribution同行評審

1 引文 斯高帕斯(Scopus)

摘要

In this paper, a low noise and robust test scheme for 3D stacked integrated circuits based on modified standard IEEE 1149.4 has been proposed. Through the modified standard, this novel test scheme can be more robust to fulfill the microsystem integration requirements. This test scheme also makes the analog pins more observable and testable during and after the integration. The proposed test scheme is validated with preliminary results. This invention provides a useful test method to guide system designers to achieve a low noise and robust test scheme while designing system specifications.

原文English
主出版物標題Proceedings of the 2011 IEEE/NIH Life Science Systems and Applications Workshop, LiSSA 2011
頁面9-13
頁數5
DOIs
出版狀態Published - 23 五月 2011
事件2011 IEEE/NIH Life Science Systems and Applications Workshop, LiSSA 2011 - Bethesda, MD, United States
持續時間: 7 四月 20118 四月 2011

出版系列

名字Proceedings of the 2011 IEEE/NIH Life Science Systems and Applications Workshop, LiSSA 2011

Conference

Conference2011 IEEE/NIH Life Science Systems and Applications Workshop, LiSSA 2011
國家United States
城市Bethesda, MD
期間7/04/118/04/11

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