A condensate-less design of cold plate in vapor-compression system applicable to high-end computing

Yu Lieh Wu, Kai Shing Yang, Shih Jie Lin, Wen Ruey Chang, Chi-Chuan Wang

研究成果: Conference contribution同行評審

摘要

A novel design featuring a two-stage expansion process is proposed in this study. Without any help of insulation, the design can minimize or even entirely eliminate the formation of condensate in the cold-plate surface for a typical refrigeration system. The design incorporates a double-pipe inlet outlet and a two-container cold plate. A detailed comparison is also made amid conventional cold plate and the present condensate-less cold plate. For the conventional cold plate, it is found that the refrigerant mass flowrate is almost unchanged with respect to heating load. However, a slight decrease of mass flowrate for the present condensate-less cold plate is seen due to additional expansion/contraction/friction loss occurring in the first container. In addition, the decay in mass flowrate results in a gradual decline of outlet temperature that is opposite to the conventional cold-plate design.

原文English
主出版物標題2009 25th Annual IEEE Semiconductor Thermal Measurement and Management Symposium, SEMI-THERM 2009 - Proceedings
頁面17-21
頁數5
DOIs
出版狀態Published - 10 七月 2009
事件2009 25th Annual IEEE Semiconductor Thermal Measurement and Management Symposium, SEMI-THERM 2009 - San Jose, CA, United States
持續時間: 15 三月 200919 三月 2009

出版系列

名字Annual IEEE Semiconductor Thermal Measurement and Management Symposium
ISSN(列印)1065-2221

Conference

Conference2009 25th Annual IEEE Semiconductor Thermal Measurement and Management Symposium, SEMI-THERM 2009
國家United States
城市San Jose, CA
期間15/03/0919/03/09

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