A compact plastic package with high RF isolation by subsidiary inner ground leads

Hidetoshi Ishida*, Kazuo Miyatsuji, Tsuyoshi Tanaka, Daisuke Ueda, Chihiro Hamaguchi

*Corresponding author for this work

研究成果: Article同行評審

1 引文 斯高帕斯(Scopus)

摘要

A novel method to obtain a compact plastic package with higher isolation by providing subsidiary inner ground leads between outer leads is proposed and demonstrated. The effect of the subsidiary ground leads is investigated by using a 3-dimensional electromagnetic field simulation and measuring the fabricated packages. Newly designed package with subsidiary ground leads achieves higher isolation by more than 10 dB at 3 GHz as compared to a conventional package. This package is applied to GaAs SPDT switch IC's. Isolation of the switch IC's is improved by 5 dB at 3 GHz by the subsidiary inner ground leads. The isolation characteristics are discussed based on the equivalent circuit extracted from the simulation results.

原文English
頁(從 - 到)2044-2048
頁數5
期刊IEICE Transactions on Electronics
E82-C
發行號11
出版狀態Published - 1 一月 1999

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