A CMOS wireless two-axis digital accelerometer using bondwire inertial sensing

Yu-Te Liao*, J. Shi, B. Otis

*Corresponding author for this work

研究成果: Conference contribution同行評審

2 引文 斯高帕斯(Scopus)

摘要

This paper presents a two-axis wireless accelerometer using bondwire inertial sensing without MEMS processing. The bondwire sensors are bonded chip-to-chip to reduce the manufacturing uncertainty. The accelerometer consists of oscillator-based inductance-to-frequency converters, a digital frequency demodulator, and a 400 MHz FSK wireless transmitter. A digitally programmable interface allows the digitalization of acceleration information and control of bandwidth and resolution of the sensor system. The accelerometer has a transducer gain of 7.5 kHz/g and a bandwidth of 1.2 kHz while consuming 63 mW.

原文English
主出版物標題2011 16th International Solid-State Sensors, Actuators and Microsystems Conference, TRANSDUCERS'11
頁面68-71
頁數4
DOIs
出版狀態Published - 1 九月 2011
事件2011 16th International Solid-State Sensors, Actuators and Microsystems Conference, TRANSDUCERS'11 - Beijing, China
持續時間: 5 六月 20119 六月 2011

出版系列

名字2011 16th International Solid-State Sensors, Actuators and Microsystems Conference, TRANSDUCERS'11

Conference

Conference2011 16th International Solid-State Sensors, Actuators and Microsystems Conference, TRANSDUCERS'11
國家China
城市Beijing
期間5/06/119/06/11

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