This paper presents a two-axis wireless accelerometer using bondwire inertial sensing without MEMS processing. The bondwire sensors are bonded chip-to-chip to reduce the manufacturing uncertainty. The accelerometer consists of oscillator-based inductance-to-frequency converters, a digital frequency demodulator, and a 400 MHz FSK wireless transmitter. A digitally programmable interface allows the digitalization of acceleration information and control of bandwidth and resolution of the sensor system. The accelerometer has a transducer gain of 7.5 kHz/g and a bandwidth of 1.2 kHz while consuming 63 mW.