A 20Gb/s 79.5mW 127GHz CMOS transceiver with digitally pre-distorted PAM-4 modulation for contactless communications

Yanghyo Kim, Boyu Hu, Yuan Du, Adrian Tang, Huan Neng Chen, Chewnpu Jou, Jason Cong, Tatsuo Itoh, Mau-Chung Chang

研究成果: Conference contribution

6 引文 斯高帕斯(Scopus)

摘要

Contactless chip-to-chip or board-to-board proximity (∼1mm) communications have been realized by using either wireless transmission [1-3], or inductive/capacitive coupling schemes [4-6]. However, their practical deployments in consumer electronics are currently limited because of bandwidth-density-inefficient OOK/ASK-only modulations [1-3], process/voltage/temperature sensitive carrier-recovery-less coherent detection [1], and large coupler footprint (6∼10mm2) for meeting bandwidth requirements [1], [4-6]. To overcome such challenges, the demonstrated contactless communication system employs a 127GHz CMOS transceiver to concurrently increase the coupling bandwidth and reduce coupling antenna size. Furthermore, a PAM-4 modulator with digital pre-distortion (DPD) in the transmitter (TX) and an envelope detecting non-coherent receiver (RX) are designed to further scale the bandwidth and eliminate carrier recovery circuitry, respectively.

原文English
主出版物標題2018 IEEE International Solid-State Circuits Conference, ISSCC 2018
發行者Institute of Electrical and Electronics Engineers Inc.
頁面278-280
頁數3
ISBN(電子)9781509049394
DOIs
出版狀態Published - 8 三月 2018
事件65th IEEE International Solid-State Circuits Conference, ISSCC 2018 - San Francisco, United States
持續時間: 11 二月 201815 二月 2018

出版系列

名字Digest of Technical Papers - IEEE International Solid-State Circuits Conference
61
ISSN(列印)0193-6530

Conference

Conference65th IEEE International Solid-State Circuits Conference, ISSCC 2018
國家United States
城市San Francisco
期間11/02/1815/02/18

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    Kim, Y., Hu, B., Du, Y., Tang, A., Chen, H. N., Jou, C., Cong, J., Itoh, T., & Chang, M-C. (2018). A 20Gb/s 79.5mW 127GHz CMOS transceiver with digitally pre-distorted PAM-4 modulation for contactless communications. 於 2018 IEEE International Solid-State Circuits Conference, ISSCC 2018 (頁 278-280). (Digest of Technical Papers - IEEE International Solid-State Circuits Conference; 卷 61). Institute of Electrical and Electronics Engineers Inc.. https://doi.org/10.1109/ISSCC.2018.8310292