60 GHz broadband MS-to-CPW hot-via flip chip interconnects

Wei Cheng Wu*, Li Han Hsu, Edward Yi Chang, Camilla Kärnfelt, Herbert Zirath, J. Piotr Starski, Yun Chi Wu

*Corresponding author for this work

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13 引文 斯高帕斯(Scopus)

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Physics & Astronomy

Engineering & Materials Science