導熱模組

Wang, C-C. (2016). 導熱模組. (專利號 I556376).

Wang, Chi-Chuan (Inventor). / 導熱模組. 專利號: I556376. 十一月 01, 2016.

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title = "導熱模組",

author = "Chi-Chuan Wang",

year = "2016",

month = nov,

day = "1",

language = "???core.languages.zh_TW???",

type = "Patent",

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Wang, C-C 十一月. 01 2016, 導熱模組, 專利號 I556376.

導熱模組. / Wang, Chi-Chuan (Inventor).

專利號: I556376. 十一月 01, 2016.

研究成果: Patent

TY - PAT

T1 - 導熱模組

AU - Wang, Chi-Chuan

PY - 2016/11/1

Y1 - 2016/11/1

M3 - Patent

M1 - I556376

ER -

Wang C-C, 發明者. 導熱模組. I556376. 2016 11月 1.

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