每年專案
個人檔案
研究專長
VLSI設計自動化
經歷
1995/6~1995/12 Senior Engineer, ZyXEL Communications Corp., Hsinchu, Taiwan
2001/6~2001/9 Summer Intern, Intel Corp., Austin,Texas
教育/學術資格
PhD, University of Wisconsin-Madison
外部位置
指紋
查看啟用 Yu-Min Lee 的研究主題。這些主題標籤來自此人的作品。共同形成了獨特的指紋。
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網路
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專案
研究成果
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A Design Flow for Micro Bump and Stripe Planning on Modern Chip-Package Co-Design
Huang, M. Y., Chen, H-M., Chen, K-N., Wu, S. H., Lee, Y-M. & Su, A. Y., 六月 2020, Proceedings - IEEE 70th Electronic Components and Technology Conference, ECTC 2020. Institute of Electrical and Electronics Engineers Inc., p. 2236-2241 6 p. 9159244. (Proceedings - Electronic Components and Technology Conference; 卷 2020-June).研究成果: Conference contribution › 同行評審
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Temperature-to-Power Mapping for Smartphones
Chiou, H. W., Lee, Y. M., Hsu, S. C., Chen, G. J., Pan, C. W. & Chen, T. Y., 七月 2020, Proceedings of the 19th InterSociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems, ITherm 2020. IEEE Computer Society, p. 783-789 7 p. 9190487. (InterSociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems, ITHERM; 卷 2020-July).研究成果: Conference contribution › 同行評審
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Learning based mesh generation for thermal simulation in handheld devices with variable power consumption
Lo, W. S., Chiou, H. W., Hsu, S. C., Lee, Y. M. & Cheng, L. C., 五月 2019, Proceedings of the 18th InterSociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems, ITherm 2019. IEEE Computer Society, p. 7-12 6 p. 8757347. (InterSociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems, ITHERM; 卷 2019-May).研究成果: Conference contribution › 同行評審
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Multi-angle bended heat pipe design using X-architecture routing with dynamic thermal weight on mobile devices
Hsiao, H. H., Chiou, H. W. & Lee, Y-M., 21 一月 2019, ASP-DAC 2019 - 24th Asia and South Pacific Design Automation Conference. Institute of Electrical and Electronics Engineers Inc., p. 70-75 6 p. (Proceedings of the Asia and South Pacific Design Automation Conference, ASP-DAC).研究成果: Conference contribution › 同行評審
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Phone-nomenon: A system-level thermal simulator for handheld devices
Chiou, H. W., Lee, Y-M., Shiau, S. Y., Pan, C. W. & Chen, T. Y., 21 一月 2019, ASP-DAC 2019 - 24th Asia and South Pacific Design Automation Conference. Institute of Electrical and Electronics Engineers Inc., p. 577-584 8 p. (Proceedings of the Asia and South Pacific Design Automation Conference, ASP-DAC).研究成果: Conference contribution › 同行評審