每年專案
個人檔案
研究專長
三維積體電路(3D IC)、異質整合、先進封裝技術
經歷
2005/05~2009/01 IBM Watson Research Center 研究員
2012/02~迄今 國立交通大學電子工程學系/電子研究所教授
2015~迄今 國立交通大學國際半導體產業學院副院長
教育/學術資格
PhD, Massachusetts Institute of Technology
外部位置
指紋
查看啟用 Kuan-Neng Chen 的研究主題。這些主題標籤來自此人的作品。共同形成了獨特的指紋。
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網路
國家層面的近期外部共同作業。通過按一下圓點深入探索詳細資料。
專案
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新南向及全球先進國家優秀外國青年學子來臺蹲點計畫(TEEP@AsiaPlus)
1/10/19 → 31/12/20
研究計畫: Ministry of Education(Include School)
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研究成果
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A Design Flow for Micro Bump and Stripe Planning on Modern Chip-Package Co-Design
Huang, M. Y., Chen, H-M., Chen, K. N., Wu, S. H., Lee, Y. M. & Su, A. Y., 六月 2020, Proceedings - IEEE 70th Electronic Components and Technology Conference, ECTC 2020. Institute of Electrical and Electronics Engineers Inc., p. 2236-2241 6 p. 9159244. (Proceedings - Electronic Components and Technology Conference; 卷 2020-June).研究成果: Conference contribution › 同行評審
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Adhesion properties of electroplating process between polyimide and metal layer for polymer/metal hybrid bonding
Lu, C. H., Yang, Y. L., Chen, C. P., Tsai, B. L. & Chen, K. N., 一月 2020, 於 : IEEE Transactions on Components, Packaging and Manufacturing Technology. 10, 1, p. 168-175 8 p., 8843892.研究成果: Article › 同行評審
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A Novel Low-Temperature Cu-Cu Direct Bonding with Cr Wetting Layer and Au Passivation Layer
Liu, D., Chen, P. C. & Chen, K. N., 六月 2020, Proceedings - IEEE 70th Electronic Components and Technology Conference, ECTC 2020. Institute of Electrical and Electronics Engineers Inc., p. 1322-1327 6 p. 9159395. (Proceedings - Electronic Components and Technology Conference; 卷 2020-June).研究成果: Conference contribution › 同行評審
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Evaluation of Metal/Polymer Adhesion and Highly Reliable Four-Point Bending Test Using Stealth Dicing Method in 3-D Integration
Yang, Y. L., Ito, H., Kim, Y. S., Ohba, T. & Chen, K. N., 六月 2020, 於 : IEEE Transactions on Components, Packaging and Manufacturing Technology. 10, 6, p. 956-962 7 p., 8966252.研究成果: Article › 同行評審
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Investigation of Pillar-Concave Structure for Low-Temperature Cu-Cu Direct Bonding in 3-D/2.5-D Heterogeneous Integration
Chou, T. C., Yang, K. M., Li, J. C., Yu, T. Y., Yang, Y. T., Hu, H. W., Liu, Y. W., Ko, C. T., Chen, Y. H., Tseng, T. J. & Chen, K-N., 八月 2020, 於 : IEEE Transactions on Components, Packaging and Manufacturing Technology. 10, 8, p. 1296-1303 8 p., 9125981.研究成果: Article › 同行評審
獎品
活動
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