ZnO nanowires lift-off from silicon substrate embedded in flexible films

Ray-Hua Horng*, Hung I. Lin, Dong Sing Wuu

*Corresponding author for this work

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Abstract

A novel lifting-off method of ZnO nanowires from Si substrate and embedded in flexible films have been proposed in this study. Compared with peeling-off method by polydimethyl-siloxane (PDMS), the embedded ZnO nanowires may suffer from external forces to change the dimension. The shape of ZnO nanowires remained almost unchanged after using the novel lifting-off process. Flexible films served as the secondary and flexible substrate after ZnO nanowires transferring from the Si substrate. The lift-off fabrication is a candidate for Si substrate recycling usage and for large area fabrication.

Original languageEnglish
Title of host publicationProceedings of the 2013 IEEE 5th International Nanoelectronics Conference, INEC 2013
Pages1-3
Number of pages3
DOIs
StatePublished - 13 Mar 2013
Event2013 IEEE 5th International Nanoelectronics Conference, INEC 2013 - Singapore, Singapore
Duration: 2 Jan 20134 Jan 2013

Publication series

NameProceedings - Winter Simulation Conference
ISSN (Print)0891-7736

Conference

Conference2013 IEEE 5th International Nanoelectronics Conference, INEC 2013
CountrySingapore
CitySingapore
Period2/01/134/01/13

Keywords

  • lift-off and flexible film
  • nanowires
  • PDMS
  • ZnO

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  • Cite this

    Horng, R-H., Lin, H. I., & Wuu, D. S. (2013). ZnO nanowires lift-off from silicon substrate embedded in flexible films. In Proceedings of the 2013 IEEE 5th International Nanoelectronics Conference, INEC 2013 (pp. 1-3). [6465936] (Proceedings - Winter Simulation Conference). https://doi.org/10.1109/INEC.2013.6465936