Young's modulus and fatigue lifetime improvements by diamond size effect on electroplated Ni-diamond nanocomposite

C. S. Huang, Yu-Ting Cheng, C. J. Yeh, H. K. Liu, Wen-Syang Hsu

Research output: Chapter in Book/Report/Conference proceedingConference contributionpeer-review

2 Scopus citations

Abstract

Fatigue and Young's modulus characterizations have been investigated using the bending-test method on microsized cantilever-beam specimens made of electroplated Ni and Ni-diamond nanocomposites with different particle sizes (i.e. 350nm and 50nm in diameter). The experimental results show that electroplated Ni-diamond nanocomposite has slightly smaller fatigue strength than that of pure electroplated Ni due to the ductility reduction resulted by the nano-diamond particles. However, once the incorporated particle size of nano-diamond is reduced from 350nm to 50nm, it has been found that the electroplated Ni-diamond nanocomposite can have higher Young's modulus (13.6% enhancement, i.e. 178GPa) and comparable fatigue strength (∼2.4GPa) with that of pure electroplated Ni.

Original languageEnglish
Title of host publicationTRANSDUCERS 2009 - 15th International Conference on Solid-State Sensors, Actuators and Microsystems
Pages180-183
Number of pages4
DOIs
StatePublished - 11 Dec 2009
EventTRANSDUCERS 2009 - 15th International Conference on Solid-State Sensors, Actuators and Microsystems - Denver, CO, United States
Duration: 21 Jun 200925 Jun 2009

Publication series

NameTRANSDUCERS 2009 - 15th International Conference on Solid-State Sensors, Actuators and Microsystems

Conference

ConferenceTRANSDUCERS 2009 - 15th International Conference on Solid-State Sensors, Actuators and Microsystems
CountryUnited States
CityDenver, CO
Period21/06/0925/06/09

Keywords

  • Bending-test
  • Fatigue
  • MEMS
  • Nanocomposite
  • Thin film
  • Young's modulus

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