Wireline/wireless RF-Interconnect for future SoC

Sai Wang Tam; Mau-Chung Chang; Jongsun Kim; Gyungsu Byun

doi:10.1109/RFIT.2011.6141771

Wireline/wireless RF-Interconnect for future SoC

Sai Wang Tam^*, Mau-Chung Chang, Jongsun Kim, Gyungsu Byun

^*Corresponding author for this work

Department of Electronics Engineering

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution › peer-review

4 Scopus citations

Abstract

In the era of the nanometer CMOS technology, due to stringent system requirements in power, performance and other fundamental physical limitations (such as mechanical reliability, thermal constraints, overall system form factor, etc.), future SOC systems are relying more on ultra-high data rates scalable, re-configurable, highly compact and reliable interconnect fabric. To overcome such challenges, we explore the use of multiband wireline and wireless RF-Interconnect (RF-I) which can communicate simultaneously through multiple frequency bands with low power signal transmission, reconfigurable bandwidth and excellent mechanical flexibility and reliability. In this paper, we review recent advances in wireline and wireless RF-I in three different potential application domains, which include Network-on-Chips (NoCs), advanced memory interface and ultra-high speed contactless connectors.

Original language	English
Title of host publication	2011 IEEE International Symposium on Radio-Frequency Integration Technology, RFIT 2011
Pages	45-48
Number of pages	4
DOIs	https://doi.org/10.1109/RFIT.2011.6141771
State	Published - 1 Dec 2011
Event	4th IEEE International Symposium on Radio-Frequency Integration Technology, RFIT2011 - Beijing, China Duration: 30 Nov 2011 → 2 Dec 2011

Publication series

Name	2011 IEEE International Symposium on Radio-Frequency Integration Technology, RFIT 2011

Conference

Conference	4th IEEE International Symposium on Radio-Frequency Integration Technology, RFIT2011
Country	China
City	Beijing
Period	30/11/11 → 2/12/11

Keywords

Advanced Memory Interface
Amplitude Shift Key (ASK)
Contactless Connector
Network-On-Chips(NoCs)
Wireline and Wireless RF-Interconnect(RF-I)

Access to Document

10.1109/RFIT.2011.6141771

Link to publication in Scopus

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Cite this

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title = "Wireline/wireless RF-Interconnect for future SoC",

abstract = "In the era of the nanometer CMOS technology, due to stringent system requirements in power, performance and other fundamental physical limitations (such as mechanical reliability, thermal constraints, overall system form factor, etc.), future SOC systems are relying more on ultra-high data rates scalable, re-configurable, highly compact and reliable interconnect fabric. To overcome such challenges, we explore the use of multiband wireline and wireless RF-Interconnect (RF-I) which can communicate simultaneously through multiple frequency bands with low power signal transmission, reconfigurable bandwidth and excellent mechanical flexibility and reliability. In this paper, we review recent advances in wireline and wireless RF-I in three different potential application domains, which include Network-on-Chips (NoCs), advanced memory interface and ultra-high speed contactless connectors.",

keywords = "Advanced Memory Interface, Amplitude Shift Key (ASK), Contactless Connector, Network-On-Chips(NoCs), Wireline and Wireless RF-Interconnect(RF-I)",

author = "Tam, {Sai Wang} and Mau-Chung Chang and Jongsun Kim and Gyungsu Byun",

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Tam, SW, Chang, M-C, Kim, J & Byun, G 2011, Wireline/wireless RF-Interconnect for future SoC. in 2011 IEEE International Symposium on Radio-Frequency Integration Technology, RFIT 2011., 6141771, 2011 IEEE International Symposium on Radio-Frequency Integration Technology, RFIT 2011, pp. 45-48, 4th IEEE International Symposium on Radio-Frequency Integration Technology, RFIT2011, Beijing, China, 30/11/11. https://doi.org/10.1109/RFIT.2011.6141771

Wireline/wireless RF-Interconnect for future SoC. / Tam, Sai Wang; Chang, Mau-Chung; Kim, Jongsun; Byun, Gyungsu.

2011 IEEE International Symposium on Radio-Frequency Integration Technology, RFIT 2011. 2011. p. 45-48 6141771 (2011 IEEE International Symposium on Radio-Frequency Integration Technology, RFIT 2011).

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution › peer-review

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