Wireline/wireless RF-Interconnect for future SoC

Sai Wang Tam*, Mau-Chung Chang, Jongsun Kim, Gyungsu Byun

*Corresponding author for this work

Research output: Chapter in Book/Report/Conference proceedingConference contribution

4 Scopus citations

Abstract

In the era of the nanometer CMOS technology, due to stringent system requirements in power, performance and other fundamental physical limitations (such as mechanical reliability, thermal constraints, overall system form factor, etc.), future SOC systems are relying more on ultra-high data rates scalable, re-configurable, highly compact and reliable interconnect fabric. To overcome such challenges, we explore the use of multiband wireline and wireless RF-Interconnect (RF-I) which can communicate simultaneously through multiple frequency bands with low power signal transmission, reconfigurable bandwidth and excellent mechanical flexibility and reliability. In this paper, we review recent advances in wireline and wireless RF-I in three different potential application domains, which include Network-on-Chips (NoCs), advanced memory interface and ultra-high speed contactless connectors.

Original languageEnglish
Title of host publication2011 IEEE International Symposium on Radio-Frequency Integration Technology, RFIT 2011
Pages45-48
Number of pages4
DOIs
StatePublished - 1 Dec 2011
Event4th IEEE International Symposium on Radio-Frequency Integration Technology, RFIT2011 - Beijing, China
Duration: 30 Nov 20112 Dec 2011

Publication series

Name2011 IEEE International Symposium on Radio-Frequency Integration Technology, RFIT 2011

Conference

Conference4th IEEE International Symposium on Radio-Frequency Integration Technology, RFIT2011
CountryChina
CityBeijing
Period30/11/112/12/11

Keywords

  • Advanced Memory Interface
  • Amplitude Shift Key (ASK)
  • Contactless Connector
  • Network-On-Chips(NoCs)
  • Wireline and Wireless RF-Interconnect(RF-I)

Fingerprint Dive into the research topics of 'Wireline/wireless RF-Interconnect for future SoC'. Together they form a unique fingerprint.

  • Cite this

    Tam, S. W., Chang, M-C., Kim, J., & Byun, G. (2011). Wireline/wireless RF-Interconnect for future SoC. In 2011 IEEE International Symposium on Radio-Frequency Integration Technology, RFIT 2011 (pp. 45-48). [6141771] (2011 IEEE International Symposium on Radio-Frequency Integration Technology, RFIT 2011). https://doi.org/10.1109/RFIT.2011.6141771