TY - GEN
T1 - Wireline/wireless RF-Interconnect for future SoC
AU - Tam, Sai Wang
AU - Chang, Mau-Chung
AU - Kim, Jongsun
AU - Byun, Gyungsu
PY - 2011/12/1
Y1 - 2011/12/1
N2 - In the era of the nanometer CMOS technology, due to stringent system requirements in power, performance and other fundamental physical limitations (such as mechanical reliability, thermal constraints, overall system form factor, etc.), future SOC systems are relying more on ultra-high data rates scalable, re-configurable, highly compact and reliable interconnect fabric. To overcome such challenges, we explore the use of multiband wireline and wireless RF-Interconnect (RF-I) which can communicate simultaneously through multiple frequency bands with low power signal transmission, reconfigurable bandwidth and excellent mechanical flexibility and reliability. In this paper, we review recent advances in wireline and wireless RF-I in three different potential application domains, which include Network-on-Chips (NoCs), advanced memory interface and ultra-high speed contactless connectors.
AB - In the era of the nanometer CMOS technology, due to stringent system requirements in power, performance and other fundamental physical limitations (such as mechanical reliability, thermal constraints, overall system form factor, etc.), future SOC systems are relying more on ultra-high data rates scalable, re-configurable, highly compact and reliable interconnect fabric. To overcome such challenges, we explore the use of multiband wireline and wireless RF-Interconnect (RF-I) which can communicate simultaneously through multiple frequency bands with low power signal transmission, reconfigurable bandwidth and excellent mechanical flexibility and reliability. In this paper, we review recent advances in wireline and wireless RF-I in three different potential application domains, which include Network-on-Chips (NoCs), advanced memory interface and ultra-high speed contactless connectors.
KW - Advanced Memory Interface
KW - Amplitude Shift Key (ASK)
KW - Contactless Connector
KW - Network-On-Chips(NoCs)
KW - Wireline and Wireless RF-Interconnect(RF-I)
UR - http://www.scopus.com/inward/record.url?scp=84863166325&partnerID=8YFLogxK
U2 - 10.1109/RFIT.2011.6141771
DO - 10.1109/RFIT.2011.6141771
M3 - Conference contribution
AN - SCOPUS:84863166325
SN - 9781457705182
T3 - 2011 IEEE International Symposium on Radio-Frequency Integration Technology, RFIT 2011
SP - 45
EP - 48
BT - 2011 IEEE International Symposium on Radio-Frequency Integration Technology, RFIT 2011
Y2 - 30 November 2011 through 2 December 2011
ER -