Wireline and wireless RF-interconnect for next generation SoC systems

Sai Wang Tam*, Mau-Chung Chang, Jongsun Kim

*Corresponding author for this work

Research output: Chapter in Book/Report/Conference proceedingConference contributionpeer-review

3 Scopus citations

Abstract

In the era of the nanometer CMOS technology, due to stringent system requirements in power, performance and other fundamental physical limitations (such as mechanical reliability, thermal constraints, overall system form factor, etc.), future SoC systems are relying more on ultra-high data rate scalable, re-configurable, highly compact and reliable interconnect fabric. To overcome such challenges, we explore the use of multiband wireline and wireless RF-Interconnect (RF-I) which can communicate simultaneously through multiple frequency bands with low power signal transmission, reconfigurable bandwidth and excellent mechanical flexibility and reliability.

Original languageEnglish
Title of host publication54th IEEE International Midwest Symposium on Circuits and Systems, MWSCAS 2011
DOIs
StatePublished - 13 Oct 2011
Event54th IEEE International Midwest Symposium on Circuits and Systems, MWSCAS 2011 - Seoul, Korea, Republic of
Duration: 7 Aug 201110 Aug 2011

Publication series

NameMidwest Symposium on Circuits and Systems
ISSN (Print)1548-3746

Conference

Conference54th IEEE International Midwest Symposium on Circuits and Systems, MWSCAS 2011
CountryKorea, Republic of
CitySeoul
Period7/08/1110/08/11

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