White thin-film flip-chip LEDs with uniform color temperature using laser lift-off and conformal phosphor coating technologies

Huan Ting Lin, Ching Ho Tien, Chen Peng Hsu, Ray-Hua Horng

Research output: Contribution to journalArticle

7 Scopus citations

Abstract

We fabricated a phosphor-conversion white light emitting diode (PC-WLED) using a thin-film flip-chip GaN LED with a roughened u-GaN surface (TFFC-SR-LED) that emits blue light at 450 nm wavelength with a conformal phosphor coating that converts the blue light into yellow light. It was found that the TFFC-SR-LED with the thin-film substrate removal process and surface roughening exhibits a power enhancement of 16.1% when compared with the TFFC-LED without a sapphire substrate. When a TFFC-SR-LED with phosphors on a Cu-metal packaging-base (TFFC-SR-Cu-WLED) was operated at a forward-bias current of 350 mA, luminous flux and luminous efficacy were increased by 17.8 and 11.9%, compared to a TFFC-SR-LED on a Cup-shaped packaging-base (TFFC-SR-Cup-WLED). The angular correlated color temperature (CCT) deviation of a TFFC-SR-Cu-WLED reaches 77 K in the range of -70° to + 70° when the average CCT of white LEDs is around 4300 K. Consequently, the TFFC-SR-LED in a conformal coating phosphor structure on a Cu packaging-base could not only increase the luminous flux output, but also improve the angular-dependent CCT uniformity, thereby reducing the yellow ring effect.

Original languageEnglish
Pages (from-to)31646-31653
Number of pages8
JournalOptics Express
Volume22
Issue number26
DOIs
StatePublished - 29 Dec 2014

Fingerprint Dive into the research topics of 'White thin-film flip-chip LEDs with uniform color temperature using laser lift-off and conformal phosphor coating technologies'. Together they form a unique fingerprint.

Cite this