Wetting behaviors of Sn-based solders on Cu and Pd surfaces

H. K. Kim*, Y. Wang, A. Maheshwari, King-Ning Tu

*Corresponding author for this work

Research output: Contribution to journalConference article

3 Scopus citations

Abstract

We have studied the surface morphology and wetting reaction of eutectic SnBi, eutectic SnPb, and pure Sn on Cu and Pd surfaces. In the case of Pd, the reactions were so fast that no quasi-equilibrium wetting angle could be measured. The compound formation has changed not only the interfaces but also the surfaces. Due to the formation of a reaction band outside the solder cap, the SnPb solder is no longer wetting the Cu surface but rather the Cu-Sn compound surface. In the wetting interface between eutectic SnPb and Cu, the morphology of the scallop-like Cu-Sn compound grains shows that we may not apply the classical model of layered compound growth to analyze the rate of soldering reactions.

Original languageEnglish
Pages (from-to)183-188
Number of pages6
JournalMaterials Research Society Symposium - Proceedings
Volume390
DOIs
StatePublished - 1 Jan 1995
EventProceedings of the Spring Meeting on MRS - San Francisco, CA, USA
Duration: 17 Apr 199520 Apr 1995

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