Wettability of Sn-0.3Ag-0.7Cu-xSb lead-free solders

Liang Zhang, King-Ning Tu, Lei Sun, Yonghuan Guo, Chengwen He

Research output: Contribution to journalArticlepeer-review

3 Scopus citations


Effect of Sb on the wettability of Sn-0.3Ag-0.7Cu lead-free solders was investigated, with different atmospheres and fluxes, the wetting balance tester was used to analyze the wettability of Sn-0.3Ag-0.7Cu-xSb solders. The results indicates that small amount of Sb can enhance the wettability of Sn-0.3Ag-0.7Cu solders. With the N2 atmosphere, the wettability of Sn-0.3Ag-0.7Cu-xSb can be increased obviously, which can be attributed to the resistance of oxidation (molten solder). Combing different fluxes, the wettability of lead-free solder can represent variation, the suitable flux can improve the wettability of Sn-0.3Ag-0.7Cu-xSb solders.

Original languageEnglish
Pages (from-to)59-62
Number of pages4
JournalHanjie Xuebao/Transactions of the China Welding Institution
Issue number1
StatePublished - 25 Jan 2015


  • Atmosphere
  • Flux
  • Lead-free solders
  • Wettability

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