Warpage Characteristics and Process Development of TSV-less Interconnection Technology

Wen-Wei Shen, Yu Min Lin, Sheng Tsai Wu, Chia Hsin Lee, Shin Yi Huang, Hsiang Hung Chang, Tao-Chih Chang, Kuan-Neng Chen

Research output: Contribution to journalArticlepeer-review

Original languageAmerican English
Pages (from-to)5558-5565
JournalJournal of Nanoscience and Nanotechnology
Volume18
Issue number8
DOIs
StatePublished - Aug 2018

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