Wafer-level Cu-Cu bonding technology

Ya Sheng Tang, Yao Jen Chang, Kuan-Neng Chen*

*Corresponding author for this work

Research output: Contribution to journalArticle

61 Scopus citations

Abstract

Semiconductor industry currently utilizes copper wafer bonding as one of key technologies for 3D integration. This review paper describes both science and technology of copper wafer bonding with regard to present applications. The classification of Cu bonding, bonding mechanisms, process developments, its microstructure evolution, as well as other characterizations are reviewed. Researches about patterned Cu bonding, future prospects, and 3D integration using Cu bonding are discussed in this paper.

Original languageEnglish
Pages (from-to)312-320
Number of pages9
JournalMicroelectronics Reliability
Volume52
Issue number2
DOIs
StatePublished - 1 Jan 2012

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