Wafer-level chip scale flexible wireless microsystem fabrication

Tzu Yuan Chao*, Yu-Ting Cheng

*Corresponding author for this work

Research output: Chapter in Book/Report/Conference proceedingConference contributionpeer-review

3 Scopus citations

Abstract

The paper demonstrates a low-cost flexible wireless microsystem fabrication technology combining the previously developed bumpless RFSOP scheme [1,2] with a special surface cleaning process to assemble a CMOS chip with an organic substrate (SU-8/PDMS) by Au-Au thermocompressive bonds (<200°C). About -15dB return loss and -0.8dB insertion loss @ 40GHz interconnecting structure and above 6MPa bonding strength make the technology practical for flexible wireless microsystem integration. Besides, taking advantage of chemical inertia of Au, a wafer-level sacrificial release process is performed for the low-cost fabrication.

Original languageEnglish
Title of host publication2011 IEEE 24th International Conference on Micro Electro Mechanical Systems, MEMS 2011
Pages344-347
Number of pages4
DOIs
StatePublished - 13 Apr 2011
Event24th IEEE International Conference on Micro Electro Mechanical Systems, MEMS 2011 - Cancun, Mexico
Duration: 23 Jan 201127 Jan 2011

Publication series

NameProceedings of the IEEE International Conference on Micro Electro Mechanical Systems (MEMS)
ISSN (Print)1084-6999

Conference

Conference24th IEEE International Conference on Micro Electro Mechanical Systems, MEMS 2011
CountryMexico
CityCancun
Period23/01/1127/01/11

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