Wafer level batch fabrication and assembly of small form factor optical pickup head

Sheng Yi Hsiao*, Chih Chun Lee, Yi Chiu, Hsi Fu Shih, Jin-Chern Chiou, Han Ping D. Shieh, Weileun Fang

*Corresponding author for this work

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Abstract

A MEMS batch assembly process for fabricating small form factor optical pickup head is proposed to minimize the complexity of assembly. Electrical and optical components are sealed in a chamber. A silicon optical bench with a packaged laser diode and crystalline-plane mirrors is demonstrated.

Original languageEnglish
Title of host publication2008 IEEE/LEOS International Conference on Optical MEMS and Nanophotonics, OPT MEMS
Pages102-103
Number of pages2
DOIs
StatePublished - 23 Oct 2008
Event2008 IEEE/LEOS International Conference on Optical MEMS and Nanophotonics, OPT MEMS - Freiburg, Germany
Duration: 11 Aug 200814 Aug 2008

Publication series

Name2008 IEEE/LEOS International Conference on Optical MEMS and Nanophotonics, OPT MEMS

Conference

Conference2008 IEEE/LEOS International Conference on Optical MEMS and Nanophotonics, OPT MEMS
CountryGermany
CityFreiburg
Period11/08/0814/08/08

Keywords

  • Crystalline plane mirror
  • Optical pickup head
  • Small form factor
  • Wafer level packaging

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  • Cite this

    Hsiao, S. Y., Lee, C. C., Chiu, Y., Shih, H. F., Chiou, J-C., Shieh, H. P. D., & Fang, W. (2008). Wafer level batch fabrication and assembly of small form factor optical pickup head. In 2008 IEEE/LEOS International Conference on Optical MEMS and Nanophotonics, OPT MEMS (pp. 102-103). [4607849] (2008 IEEE/LEOS International Conference on Optical MEMS and Nanophotonics, OPT MEMS). https://doi.org/10.1109/OMEMS.2008.4607849