Wafer level batch fabrication and assembly of small form factor optical pickup head

Sheng Yi Hsiao*, Chih Chun Lee, Yi Chiu, Hsi Fu Shih, Jin-Chern Chiou, Han-Ping Shieh, Weileun Fang

*Corresponding author for this work

Research output: Chapter in Book/Report/Conference proceedingConference contributionpeer-review

Abstract

A MEMS batch assembly process for fabricating small form factor optical pickup head is proposed to minimize the complexity of assembly. Electrical and optical components are sealed in a chamber. A silicon optical bench with a packaged laser diode and crystalline-plane mirrors is demonstrated.

Original languageAmerican English
Title of host publication2008 IEEE/LEOS International Conference on Optical MEMS and Nanophotonics, OPT MEMS
PublisherIEEE
Pages102-103
Number of pages2
ISBN (Print)9781424419180
DOIs
StatePublished - 23 Oct 2008
Event2008 IEEE/LEOS International Conference on Optical MEMS and Nanophotonics, OPT MEMS - Freiburg, Germany
Duration: 11 Aug 200814 Aug 2008

Publication series

Name2008 IEEE/LEOS International Conference on Optical MEMS and Nanophotonics, OPT MEMS

Conference

Conference2008 IEEE/LEOS International Conference on Optical MEMS and Nanophotonics, OPT MEMS
CountryGermany
CityFreiburg
Period11/08/0814/08/08

Keywords

  • Crystalline plane mirror
  • Optical pickup head
  • Small form factor
  • Wafer level packaging

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